Product chungchang chipchiar zawk:
Microcrystalline phosphorus copper ball hi electroplated hmanga siam copper anode material a ni a, hei hi a chhuahna tur hmun leh a hmanna tur hmun a ni. A component ber chu copper a ni a, a tlangpuiin copper content chu 99.94% aia tam a ni a, phosphorus content chu 250 atanga 650 ppm inkar a ni. Heng thil siamte hi electroplating copper siamna lama PCB siamna, decoration leh surface treatment, leh photovoltaic industry-ah te hman a ni ber. Microcrystalline phosphorus copper balls hian industry- hmahruaitu fully automatic cold heading process hmangin step khata sphere te chu an siam a ni. Microcrystallization treatment hmang hian microcrystalline phosphorus copper ball, grain size 50 um aia tlem lo siam a ni. Anode film (phosphorus copper film) hian performance tha zawk a lantir a, application performance tha zawkin a ti tha a, unit copper consumption a ti tlem bawk. Experiment-ah chuan microcrystalline phosphorus copper balls hian copper hman zawng zawng 3% aia tam a tihhniam theih thu a tarlang.
Cu-phos Ball hman dan:
Microcrystalline phosphorus copper ball hi electroplated hmanga siam copper anode material a ni a, hei hi a chhuahna tur hmun leh a hmanna tur hmun a ni. He product hi electroplated copper siamna field-ah te hman a ni ber a, chungte chu PCB siamna, decoration, LED components, leh hardware parts leh surface treatment-ah te hman a ni. Microcrystallization treatment hmang hian microcrystalline phosphorus copper ball, grain size um aia tlem lo siam a ni. Anode film performance a tha zawk a, application performance a ti tha zawk a, unit copper consumption a ti tlem bawk.
Cu-phos Ball chungchang hi:
