Hard Drawn Copper Foil hmanga siam a ni

Hard-drawn copper foil hi copper wire diameter lian zawk leh tensile strength sang zawk atanga siam a ni a, conductor atan hman a ni.
Hard-drawn Copper foil hi metallic material pawimawh tak a ni a, a chakna sang tak, conductivity leh heat conductivity sang tak a nei a ni.
Standard: TB/T3111-2005 chhunga hman tur a ni.

Electronic leh electrical lama hman: Copper foil hi printed circuit board (PCB)-a conductive layer atan hman a ni fo. Copper foil hi conductive line siamna atana base material atan hman theih a ni a, electronic device, communication equipment, computer leh electronic product dang siamnaah hman a ni.

Electromagnetic shielding: Copper foil hian electromagnetic shielding property tha tak a nei a, electromagnetic wave interference block emaw tihtlem emaw turin electromagnetic shielding material siam nan hman theih a ni. Copper foil shielding materials hi electronic device, electromagnetic shielding room, communication system leh medical equipment, etc. ah te hman a ni nasa hle a, shielding leh protection performance tha tak a pe a ni.

Heat conduction materials: Copper foil hian thermal conductivity sang tak a neih avangin heat conduction material tha tak a ni. Heat sink, heat transfer plate, chip cooling, etc.-ah te hman a ni fo thin a, hei hi heat tha taka kalpui leh tihbo nan a ni.

Decorative leh artistic application: Copper foil hi metallic luster leh malleability avang hian decorative leh artistic field-ah te hman a ni nasa hle. Copper foil hmang hian decoration, sculpture, painting background, handicraft, etc. siam theih a ni a, hnathawh hrang hrangte chu a danglam bikna leh a texture a belhchhah thei a ni.
Packaging materials: Copper foil hi a nem leh a chhe thei lo avangin packaging material tha tak a ni. Food packaging, damdawi packaging, electronic component packaging, etc.-ah te hman theih a ni a, shielding leh protection performance tha tak a pe a ni.

Copper foil hmanna field hi a zau hle a ni. Application area lian thenkhat chu hetiang hi a ni:
Lithium battery field: Lithium battery copper foil hi lithium battery-a negative electrode material carrier leh current collector siamtu thil pawimawh tak a ni a, ductility tha tak, conductivity tha tak, leh chemical property nghet tak a nei a ni. Lithium battery copper foil hian raw material tam tak a nei a, processing technology puitling tak tak a nei a, processing cost a tlem bawk a, hei vang hian lithium battery-a negative electrode material carrier leh current collector atan duhthlanna duh ber a ni.

Electronic circuit field: Electrolytic copper foil hi copper clad laminates (CCL) leh printed circuit board (PCB) siamna atana hmanraw pawimawh tak a ni a, chubakah lithium-ion battery siamna atan pawh a pawimawh hle. Tuna information technology industry hmasawnna chak takah hian electrolytic copper foil hi electronic product-a signal leh power transmission leh communication atana "nerve network" tia hriat a ni.

Soft packaging field: Soft packaging chu bag- ang chi, soft composite packaging material hmanga siam a ni. Soft packaging lo chhuahna hian ei leh in industry-a mechanization leh automation level nasa takin a tichangtlung a, mipui ei leh in nun modernization leh socialization process pawh a ti chak hle bawk.

Automobile field: Market-a automotive foil mamawhna a pung chak hle. Automotive foil hi chi hnih a awm a, pakhat chu automotive air conditioner atana composite foil a ni a, pakhat chu automotive radiator atana composite foil a ni a, automotive water tank radiator, automotive condenser leh evaporator siamna atana hman a ni.

Electrolytic capacitor field: Electrolytic capacitor-a hman thin copper foil hi corrosion material a ni a, polar condition-ah hna a thawk thin. Electrolytic capacitor hian performance tha tak, man tlawm, leh application zau tak a nei a, chuvangin market prospect beisei awm tak an nei a ni.