Copper hian boruak vawt takah chuan corrosion resistance tha tak a nei a, mahse high-humidity emaw sulfur-containing gas environment-ah chuan patina a siam duh hle a, chu chuan contact resistance a tipung a ni. Aluminium chunglam chu oxide film dense tak a siam duh a, chu chuan a hmin belh zel tur a veng thei zawk a ni. Mahse, oxide film (10−6Ω·cm2 vel) resistance hi copper substrate (10−6Ω·cm2) aiin a sang zawk hle a, tin plating, nickel plating emaw anodic oxidation treatment hmanga tihchangtlun a ngai a ni.
Electrical conductivity-a temperature-in nghawng a neih danah chuan copper-a temperature coefficient of resistance (0.0043/℃) chu aluminium (0.0041/℃) aiin a hniam zawk a, mahse aluminium-a thermal expansion coefficient (23.6×10−6/℃) chu copper (16.5×1066/℃) aiin a let 1.4-in a tam zawk a ni ). Temperature inthlak danglamna nasa tak awmna scenario-ah chuan aluminum bar-te thermal expansion leh contraction a langsar zawk a, hei hian connection point-ah loosening a thlen thei a ni. Hei hi structural design (expansion gap reserving ang chi) emaw, flexible connector hmanga tihziaawm theih a ni.